3D PROCESS MODELLING ON PERSONAL COMPUTERS
Abstract
A method for reducing the computation needs of modellingcomplete fabrication processes for VLSI devices on personal computers in 3 dimensions, a treatment of equitations of basic physical processes, such as diffusion, oxidation, implantation, etching and deposition is presented. In the paper we will describe the structure of the TEDI (TechnologyDialog) program, the main formulas and principles of the models and some examples of 3D process simulation. The third part of the "TEDI" program (creating a set of control parameters, automatic simulation and graphical output of results) provides flexible possibilities of studyingthe connections between 1D, 2D and 3D simulations.
Keywords:
Process modelling, VLSI technologyHow to Cite
Zur, A., Binh, V. T. “3D PROCESS MODELLING ON PERSONAL COMPUTERS”, Periodica Polytechnica Electrical Engineering, 34(1), pp. 47–54, 1990.
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