ON THE SIMULATION OF IC CHIP TEMPERATURE DISTRIBUTION

Abstract

A new algorithm is found and a computer program developed for the more exact calculation of lC chip surface temperature distribution. The algorithm takes into account the effect of non-ideal (non-isotherm) heat-sink and the heat conductivity of bonding wires as well. The simulation is based on the fast Fourier-cosinus calculation method. The heat conducting effect of lC's environment is considered by linear calculation methods. The computer simulation is supported by measurements taken by liquid crystal.