Determining whiskering properties of tin-copper alloy solder-dipped platings

Abstract

This paper reports the effect of humidity on whisker formation in pure tin and tin-copper alloy platings. Samples with copper substrates were plated with 10 μ m pure tin or tin-copper alloys (with up to 5\% Cu content). The samples were stored in high humidity (105 C/100\% RH) for over 2000 hours to examine the effect of humidity in whisker growth on different tin-copper alloys. Results indicate differences in whisker growth depending on the copper content. The series of tests show the significance of humidity and melting temperature of the plating alloy for whisker formation.