HORVÁTH, Barbara; ILLÉS, Balázs; SHINOHARA, Tadashi; HARSÁNYI, Gábor. Determining whiskering properties of tin-copper alloy solder-dipped platings. Periodica Polytechnica Electrical Engineering, [S. l.], v. 54, n. 3-4, p. 107–110, 2010. 10.3311/pp.ee.2010-3-4.04. Disponível em: https://pp.bme.hu/ee/article/view/826. Acesso em: 5 may. 2024.