KRAMMER, Olivér; ILLYEFALVI-VITÉZ, Zsolt. Investigating the self-alignment of chip components during reflow soldering. Periodica Polytechnica Electrical Engineering, [S. l.], v. 52, n. 1-2, p. 67–75, 2008. 10.3311/pp.ee.2008-1-2.08. Disponível em: https://pp.bme.hu/ee/article/view/856. Acesso em: 6 oct. 2024.