SINKOVICS, Bálint; HARSÁNYI, Gábor. Modelling thermal behavior of surface mounted components during reflow soldering. Periodica Polytechnica Electrical Engineering, [S. l.], v. 52, n. 1-2, p. 77–84, 2008. 10.3311/pp.ee.2008-1-2.09. Disponível em: https://pp.bme.hu/ee/article/view/857. Acesso em: 28 may. 2024.