Horváth B, Illés B, Shinohara T, Harsányi G. Determining whiskering properties of tin-copper alloy solder-dipped platings. Period. Polytech. Elec. Eng. [Internet]. 2010 Jan. 1 [cited 2024 May 5];54(3-4):107-10. Available from: https://pp.bme.hu/ee/article/view/826