1.
Krammer O, Illyefalvi-Vitéz Z. Investigating the self-alignment of chip components during reflow soldering. Period. Polytech. Elec. Eng. [Internet]. 2008 Jan. 1 [cited 2024 Oct. 6];52(1-2):67-75. Available from: https://pp.bme.hu/ee/article/view/856