G. Bognár, G. Takács, P. G. Szabó, G. Rózsás, L. Pohl, and B. Plesz, “Integrated Thermal Management in System-on-Package Devices”, Period. Polytech. Elec. Eng. Comp. Sci., vol. 64, no. 2, pp. 200–210, Jan. 2020.