Németh M, Poppe A. Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment. Period. Polytech. Elec. Eng. Comp. Sci. [Internet]. 2018 Jan. 1 [cited 2024 Apr. 19];62(1):1-15. Available from: https://pp.bme.hu/eecs/article/view/11058