1.
Otáhal A, Šimek V, Crha A, Růžička R, Szendiuch I. Innovative Methods in Activation Process of Through-hole Plating. Period. Polytech. Elec. Eng. Comp. Sci. [Internet]. 2016Jan.1 [cited 2020Sep.19];60(4):217-22. Available from: https://pp.bme.hu/eecs/article/view/9686