Vol. 52 No. 1-2 (2008)

Analysis of solder joint failures arisen during the soldering process

Bálint Balogh, Gábor Harsányi, Róbert Kovács, Csaba Nagynémedi, Bence Papp

5-11
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Fractal description of dendrite growth during electrochemical migration

Csaba Dominkovics, Gábor Harsányi

13-19
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X-ray imaging in pin-in-paste technology

Mihály Janóczki, Zoltán Radvánszki, László Jakab, Olivér Krammer

21-29
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Analysis of 355 nm Nd:YAG laser interaction with patterned flexible circuit substrates

Péter Gordon, Bálint Balogh, Bálint Sinkovics, Zsolt Illyefalvi-Vitéz

31-37
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3D Flexible package formation using laser micromachining

Richárd Berényi, Zsolt Illyefalvi-Vitéz

39-44
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Embedded thick-film resistors applied in low temperature co-fired ceramic circuit substrates

Eszter Horváth

45-57
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3D mapping of forced convection efficiency in reflow ovens

Balázs Illés, Gábor Harsányi

59-65
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Investigating the self-alignment of chip components during reflow soldering

Olivér Krammer, Zsolt Illyefalvi-Vitéz

67-75
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Modelling thermal behavior of surface mounted components during reflow soldering

Bálint Sinkovics, Gábor Harsányi

77-84
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Fetal pulse oximeter for in situ monitoring during labour and birth

Ákos Becker, Gábor Harsányi

85-89
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Non-invasive calibration method for pulse oximeters

Stubán, Norbert, Masatsugu, Niwayama

91-94
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Modular biosensor reaction-cell

Hunor Sántha, Attila Bonyár

95-109
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1D nanostructures grown on GaAs and InP substrates

László Milán Molnár, Imre Mojzes, Sándor Misák

111-115
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Detecting semantically related concepts in a SOA integration scenario

Péter Martinek, Béla Szikora

117-125
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