Integrated Thermal Management in System-on-Package Devices

  • György Bognár Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, H-1521 Budapest, P. O. B. 91, Hungary
  • Gábor Takács Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, H-1521 Budapest, P. O. B. 91, Hungary
  • Péter G. Szabó Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, H-1521 Budapest, P. O. B. 91, Hungary
  • Gábor Rózsás Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, H-1521 Budapest, P. O. B. 91, Hungary
  • László Pohl Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, H-1521 Budapest, P. O. B. 91, Hungary
  • Balázs Plesz Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, H-1521 Budapest, P. O. B. 91, Hungary

Abstract

Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator.

Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator.

Keywords: microscale cooling, thermal management, thermal characterization, thermo-hydrodynamic modeling
Published online
2019-12-18
How to Cite
Bognár, G., Takács, G., Szabó, P. G., Rózsás, G., Pohl, L. and Plesz, B. (ONLINE) “Integrated Thermal Management in System-on-Package Devices”, Periodica Polytechnica Electrical Engineering and Computer Science. https://doi.org/10.3311/PPee.14986.
Section
Articles