Innovative Methods in Activation Process of Through-hole Plating

  • Alexandr Otáhal Brno University of Technology, FEEC
  • Václav Šimek Brno University of Technology, FIT
  • Adam Crha Brno University of Technology, FIT
  • Richard Růžička Brno University of Technology, FIT
  • Ivan Szendiuch Brno University of Technology, FEEC

Abstract

This paper is dealing with an in-depth verification of innovated activation methods, where the phase of surface treatment involves solvent with oxides of carbon as the core chemistry. The overall impact of solvent on through-hole copper plating process was tested on target t structures involving standard FR-4 PCB substrate. The novelty of the approach proposed here is based on the effect of an unusual combination of vacuum and ultrasound waves in order to enhance quality of the activation process. The results undoubtedly demonstrated significant benefits of vacuum and vacuum/ultrasound combination on the decreasing number of defects, which normally occurred during the conventional plating process. In addition, there was also discovered that the resulting number of failures was increased even despite the use of ultrasound.
Keywords: plated-through holes, PCB activation, reverse pulse plating, vacuum, ultrasound
Published online
2016-09-07
How to Cite
Otáhal, A., Šimek, V., Crha, A., Růžička, R. and Szendiuch, I. (2016) “Innovative Methods in Activation Process of Through-hole Plating”, Periodica Polytechnica Electrical Engineering and Computer Science, 60(4), pp. 217-222. doi: https://doi.org/10.3311/PPee.9686.
Section
VINMES Special Issue - Novel Trends in Electronics Technology