Alloying Effects on Wetting Ability of Diluted Cu-Sn Melts on Graphite Substrates

Abstract

The wettability of graphite by the copper-tin (Cu-Sn) liquid alloy was measured using the sessile drop method at a temperature interval of 1273 – 1473 K. The system is found poorly wetting with the contact angle at an interval of 115 … 143 degrees. The concentration dependence of contact angle (Θ) exhibits similar trends, than the residual resistivity change measured in the same alloys in solid state. The solid solution of Cu-Sn has a huge effect to the wetting ability, which was measured liquid phase beyond the liquidus.