Alloying Effects on Wetting Ability of Diluted Cu-Sn Melts on Graphite Substrates

Authors

  • Illés Salacz
    Affiliation

    Department of Automobiles and Vehicle Manufacturing, BME

  • Zoltán Weltsch
    Affiliation

    Department of Automobiles and Vehicle Manufacturing, BME

https://doi.org/10.3311/PPtr.7112

Abstract

The wettability of graphite by the copper-tin (Cu-Sn) liquid alloy was measured using the sessile drop method at a temperature interval of 1273 – 1473 K. The system is found poorly wetting with the contact angle at an interval of 115 … 143 degrees. The concentration dependence of contact angle (Θ) exhibits similar trends, than the residual resistivity change measured in the same alloys in solid state. The solid solution of Cu-Sn has a huge effect to the wetting ability, which was measured liquid phase beyond the liquidus.

Keywords:

wetting; contact angle; copper; tin; solid solution

Published Online

2014-02-11

How to Cite

Salacz, I., Weltsch, Z. (2013) “Alloying Effects on Wetting Ability of Diluted Cu-Sn Melts on Graphite Substrates”, Periodica Polytechnica Transportation Engineering, 41(2), pp. 123–126. https://doi.org/10.3311/PPtr.7112

Issue

Section

Articles